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1

Packaging reliability estimation of high-power device modules by utilizing silver sintering technology

Lee, Chang-Chun, Kuo, Kuo-Shu, Wang, Chi-Wei, Chang, Jing-Yao, Han, Wei-Kuo, Chang, Tao-Chih

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 670 KB

2020

2

Reliability estimation and failure mode prediction for 3D chip stacking package with the application of wafer-level underfill

Lee, Chang-Chun, Yang, Tsung-Fu, Wu, Chih-Sheng, Kao, Kuo-Shu, Cheng, Ren-Chin, Chen, Tai-Hong

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 3.20 MB

english, 2013

3

Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture

Jing-Yao Chang, Ren-Shin Cheng, Kuo-Shu Kao, Tao-Chih Chang, Tung-Han Chuang

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 2.67 MB

english, 2012

4

Investigation of pre-bending substrate design in packaging assembly of an IGBT power module

Lee, Chang-Chun, Kao, Kuo-Shu, Lin, Leon, Chang, Jing-Yao, Leu, Fang-Jun, Lu, Yu-Lan, Chang, Tao-Chih

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 3.49 MB

english, 2014

5

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Evaluation of Cu/Ni/SnAg microbump bonding processes for thin-chip-on-chip package using a wafer-level underfill film

Chang-Chun Lee,, Yang, Tsung-Fu, Kao, Kuo-Shu, Cheng, Ren-Chin, Zhan, Chau-Jie, Tai-Hong Chen,

Year:

2012

Language:

english

File:

PDF, 817 KB

english, 2012

6

Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film

Lee, Chang-Chun, Yang, Tsung-Fu, Kao, Kuo-Shu, Cheng, Ren-Chin, Zhan, Chau-Jie, Chen, Tai-Hong

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.29 MB

english, 2012

7

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

Lin, Yu-Min, Zhan, Chau-Jie, Kao, Kuo-Shu, Fan, Chia-Wen, Chung, Su-Ching, Huang, Yu-Wei, Huang, Shin-Yi, Chang, Jing-Yao, Yang, Tsung-Fu, Lau, John H., Chen, Tai-Hung

Year:

2012

Language:

english

File:

PDF, 2.58 MB

english, 2012

8

The loop identification and classification algorithms for digraph-based safety analysis

Chuei-Tin Chang, Ho-Chuan Hwang, Kuo-Shu Hwang, Ding-Shan Hsu

Journal:

Computers & Chemical Engineering

Year:

1997

Language:

english

File:

PDF, 938 KB

english, 1997

9

Characteristics of high dielectric cubic Gd2O3 thin films deposited on cubic LaAlO3 by pulsed laser deposition

Kuo-Shu Chang, Li-Zen Hsieh, Shan-Kan Huang, Ching-Yuan Lee, Yu-Sheng Chiu

Journal:

Journal of Crystal Growth

Year:

2008

Language:

english

File:

PDF, 577 KB

english, 2008

10

Lateral preferences for hand, foot and eye, and their lack of association with scholastic achievement, in 4143 Chinese

Evelyn Lee Teng, Pen-Hua Lee, Kuo-Shu Yang, Pottor C. Chang

Journal:

Neuropsychologia

Year:

1979

Language:

english

File:

PDF, 356 KB

english, 1979

11

Dechlorination of 2,4,6-TCP by an anaerobic mixed culture

Bea-Ven Chang, Kuo-Shu Chen, Shaw-Ying Yuan

Journal:

Year:

1995

Language:

english

File:

PDF, 424 KB

english, 1995

12

Reliability enhancements of chip-on-chip package with layout designs of microbumps

Lee, Chang-Chun, Kao, Kuo-Shu, Cheng, Ren-Shin, Zhan, Chau-Jie, Chang, Tao-Chih

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 2.75 MB

english, 2014

13

Total and organic mercury concentrations in the muscles of Pacific albacore (Thunnus alalunga) and bigeye tuna (Thunnus obesus)

Chen, Chiee-Young, Lai, Chien-Cheng, Chen, Kuo-Shu, Hsu, Chien-Chung, Hung, Chin-Chang, Chen, Meng-Hsien

Journal:

Marine Pollution Bulletin

Year:

2014

Language:

english

File:

PDF, 1.12 MB

english, 2014

14

Increased zooplankton PAH concentrations across hydrographic fronts in the East China Sea

Hung, Chin-Chang, Ko, Fung-Chi, Gong, Gwo-Ching, Chen, Kuo-Shu, Wu, Jian-Ming, Chiang, Hsin-Lun, Peng, Sen-Chueh, Santschi, Peter H.

Journal:

Marine Pollution Bulletin

Year:

2014

Language:

english

File:

PDF, 1.97 MB

english, 2014

15

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Characteristics of 600 V / 450 A IGBT module assembled by Ag sintering technology

Chang, Jing-Yao, Su-Yu Fun,, Leu, Fang-Jun, Kao, Kuo-Shu, Chih-Ming Tzeng,, Wei-Kuo Han,, Chang, Tao-Chih

Year:

2014

Language:

english

File:

PDF, 564 KB

english, 2014

16

Studies on the Digraph-Based Approach for Fault-Tree Synthesis. 1. The Ratio-Control Systems

Chang, Chuei-Tin, Hwang, Kuo-Shu

Journal:

Industrial & Engineering Chemistry Research

Year:

1994

Language:

english

File:

PDF, 1.09 MB

english, 1994

17

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Fine pitch “NCF-type compliant-bumped COG”

Chao-Chyun An,, Shyh-Ming Chang,, Ming-Yao Chen,, Kuo-Shu Kao,, Tsang, Jimmy, Sheng-Shu Yang,, Chih Chen,, Chung-Kuang Lin,, Ren-Haw Chen,, Wen-Chih Chen,

Year:

2007

Language:

english

File:

PDF, 141 KB

english, 2007

18

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Application of numerical analysis to the reliability assessment of a novel package on package (PoP) structure for memory stacking

Kao, Kuo-Shu, Wu, Sheng-Tsai, Hung, Yin-Po, Chang, Tao-Chih, Cheng, Ren-Shin, Chen, Tai-Hong

Year:

2010

Language:

english

File:

PDF, 548 KB

english, 2010

19

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads

Tsai, M. Y., Huang, C. Y., Ting, C. W., Kuo-Shu Kao,, Ming-Yao Chen,, Tsang, Jimmy, Sheng-Shu Yang,, Cho-Chyun An,, Shyh-Ming Chang,

Year:

2007

Language:

english

File:

PDF, 1.12 MB

english, 2007

20

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Low temperature micro-bumping assembly technology for 3D integration

Chen, Yu-Hua, Lee, Ching-Kuan, Hsiao, Zhi-Cheng, Chang, Jing-Yao, Zhan, Chau-Jie, Huang, Yu-Jiau, Chen, Shang-Wei, Huang, Shin-Yi, Fan, Chia-Wen, Lin, Yu-Min, Kao, Kuo-Shu, Ko, Cheng-Ta, Lo, Wei-Chung

Year:

2012

Language:

english

File:

PDF, 2.07 MB

english, 2012

21

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Electrical characterization of fine-pitch compliant bumps

Lin, C. K., Chih Chen,, Shyh-Ming Chang,, Chao-Chyun An,, Hsiao Ting Lee,, Kuo-Shu Kao,, Jimmy Tsang,, Sheng-Shu Yang,

Year:

2009

Language:

english

File:

PDF, 2.29 MB

english, 2009

22

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Electrical characterization of fine-pitch compliant bumps

Lin, C. K., Chen, Chih, Chang, Shyh-Ming, An, Chao-Chyun, Lee, Hsiao Ting, Kao, Kuo-Shu, Tsang, Jimmy, Yang, Sheng-Shu

Year:

2008

Language:

english

File:

PDF, 3.76 MB

english, 2008

23

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Assembly and reliability assessment of 50µm-thick chip stacking by wafer-level underfill film

Kuo-Shu Kao,, Ren-Shin Cheng,, Chau-Jie Zhan,, Chang, Jing-Yao, Tsung-Fu Yang,, Shin-Yi Huang,, Chia-Wen Fan,, Su-Mei Chen,, Su-Ching Chung,, Yu-Lan Lu,, Mei-Lun Wu,, Tai-Hung Chen,

Year:

2012

Language:

english

File:

PDF, 2.29 MB

english, 2012

24

[IEEE 2013 4th IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG) - Rogers, AR (2013.07.8-2013.07.11)] 2013 4th IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG) - 600V, 450A IGBT power module for 50kw electrical vehicle

Chun-Kai Liu,, Yu-Lin Chao,, June-Chien Chang,, Wei Li,, Chih-Ming Tzeng,, Rong-Chang Fang,, Kuo-Shu Kao,, Tao-Chih Chang,, Chang-Sheng Chen,, Ming-Kan Liang,, Wei-Chung Lo,

Year:

2013

Language:

english

File:

PDF, 1.28 MB

english, 2013

25

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Assembly analysis of Cu/Ni/SnAg microbump for stacking thin chips in a fine pitch package using a wafer-level underfill

Lee, Chang-Chun, Yang, Tsung-Fu, Kuo-Shu Kao,, Ren-Chin Cheng,, Zhan, Chau-Jie

Year:

2012

Language:

english

File:

PDF, 766 KB

english, 2012

26

Clinical diagnosis of pandemic A(H1N1) 2009 influenza in children with negative rapid influenza diagnostic test by lymphopenia and lower C-reactive protein levels

Wang, Lin, Chang, Ling-Sai, Lee, Ing-Kit, Tang, Kuo-Shu, Li, Chung-Chen, Eng, Hock-Liew, You, Huey-Ling, Yang, Kuender D.

Journal:

Influenza and Other Respiratory Viruses

Year:

2014

Language:

english

File:

PDF, 221 KB

english, 2014

27

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - IGBT power module packaging for EV applications

Chun-Kai Liu,, Yu-Lin Chao,, June-Chien Chang,, Wei Li,, Chih-Ming Tzeng,, Rong-Chang Fang,, Kuo-Shu Kao,, Tao-Chih Chang,, Chang-Sheng Chen,, Wei-Chung Lo,

Year:

2012

Language:

english

File:

PDF, 569 KB

english, 2012

28

Room temperature epitaxial growth of (001) CeO 2 on (001) LaAlO 3 by pulsed laser deposition

Ho, Yen-Teng, Chang, Kuo-Shu, Liu, Kou-Chen, Hsieh, Li-Zen, Liang, Mei-Hui

Journal:

Crystal Research and Technology

Year:

2013

Language:

english

File:

PDF, 321 KB

english, 2013

29

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration

Lee, Ching-Kuan, Chang, Tao-Chih, Huang, Yu-Jiau, Fu, Huan-Chun, Huang, Jui-Hsiung, Hsiao, Zhi-Cheng, Lau, John H., Ko, Cheng-Ta, Cheng, Ren-Shin, Chang, Pei-Chen, Kao, Kuo-Shu, Lu, Yu-Lan, Lo, Robert

Year:

2011

Language:

english

File:

PDF, 2.53 MB

english, 2011

30

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - The first MIT 600 V/450 a IGBT module for EV/HEV applications

Kao, Kuo-Shu, Leu, Fang-Jun, Chang, Jing-Yao, Fan, Su-Yu, Lu, Yu-Lan, Chang, Tao-Chih

Year:

2013

Language:

english

File:

PDF, 957 KB

english, 2013

31

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Huang, Shin-Yi, Zhan, Chau-Jie, Huang, Yu-Wei, Lin, Yu-Min, Fan, Chia-Wen, Chung, Su-Ching, Kao, Kuo-Shu, Chang, Jing-Yao, Wu, Mei-Lun, Yang, Tsung-Fu, Lau, John H., Chen, Tai-Hung

Year:

2012

Language:

english

File:

PDF, 1.42 MB

english, 2012

32

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Theoretical Stress Calculation and Experimental Results of "NCF-type Compliant-Bumped COG"

Chen, Ming-Yao, An, Chao-Chyun, Chang, Shyh-Ming, Kao, Kuo-Shu, Tsang, Jimmy, Yang, Sheng-Shu, Chen, Chih, Lin, Chung-Kuang

Year:

2007

Language:

english

File:

PDF, 1.26 MB

english, 2007

33

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding

Chang, Tao-Chih, Cheng, Ren-Shin, Kao, Kuo-Shu, Li, Wei, Lee, Ching-Kuan, Chang, Jing-Yao, Huang, Shin-Yi, Fan, Chia-Wen, Hung, Yin-Po, Huang, Yu-Wei, Lin, Yu-Min, Chen, Tai-Hong, Leu, Fang-Jun, Fun,

Year:

2011

Language:

english

File:

PDF, 5.97 MB

english, 2011

34

Enhanced POC export in the oligotrophic northwest Pacific Ocean after extreme weather events

Chen, Kuo-Shu, Hung, Chin-Chang, Gong, Gwo-Ching, Chou, Wen-Chen, Chung, Chih-Ching, Shih, Yung-Yen, Wang, Chau-Chang

Journal:

Geophysical Research Letters

Year:

2013

Language:

english

File:

PDF, 933 KB

english, 2013

35

Hypercholesterolemia Is Correlated With an Increased Risk of Idiopathic Sudden Sensorineural Hearing Loss

Chang, Shih-Lun, Hsieh, Chen-Chou, Tseng, Kuo-Shu, Weng, Shih-Feng, Lin, Yung-Song

Journal:

Year:

2014

Language:

english

File:

PDF, 325 KB

english, 2014

36

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Achievement of low temperature chip stacking by a wafer-applied underfill material

Cheng, Ren-Shin, Kao, Kuo-Shu, Chang, Jing-Yao, Hung, Yin-Po, Yang, Tsung-Fu, Huang, Yu-Wei, Chen, Su-Mei, Chang, Tao-Chih, Huang, Qiaohong, Guino, Rose, Hoang, Gina, Bai, Jie, Becker, Kevin

Year:

2011

Language:

english

File:

PDF, 2.28 MB

english, 2011

37

Melatonin in the Regulation of Liver Steatosis following Prenatal Glucocorticoid Exposure

Tiao, Mao-Meng, Huang, Li-Tung, Chen, Chih-Jen, Sheen, Jiunn-Ming, Tain, You-Lin, Chen, Chih-Cheng, Kuo, Ho-Chang, Huang, Ying-Hsien, Tang, Kuo-Shu, Chu, En-Wei, Yu, Hong-Ren

Journal:

BioMed Research International

Year:

2014

Language:

english

File:

PDF, 2.72 MB

english, 2014

38

Field Observations of Changes in SST, Chlorophyll and POC Flux in the Southern East China Sea Before and After the Passage of Typhoon Jangmi

Shih, Yung-Yen, Hsieh, Jin-Sheng, Gong, Gwo-Ching, Hung, Chin-Chang, Chou, Wen-Chen, Lee, Ming-An, Chen, Kuo-Shu, Chen, Meng-Hsien, Wu, Chau-Ron

Journal:

Terrestrial Atmospheric and Oceanic Sciences

Year:

2013

Language:

english

File:

PDF, 5.47 MB

english, 2013

39

Correlation of Pandemic (H1N1) 2009 Viral Load with Disease Severity and Prolonged Viral Shedding in Children

Li, Chung-Chen, Wang, Lin, Eng, Hock-Liew, You, Huey-Ling, Chang, Ling-Sai, Tang, Kuo-Shu, Lin, Ying-Jui, Kuo, Hsuan-Chang, Lee, Ing-Kit, Liu, Jien-Wei, Huang, Eng-Yen, Yang, Kuender D.

Journal:

Emerging Infectious Diseases

Year:

2010

Language:

english

File:

PDF, 5.66 MB

english, 2010

40

[IEEE 2015 International Symposium on Next-Generation Electronics (ISNE) - Taipei, Taiwan (2015.5.4-2015.5.6)] 2015 International Symposium on Next-Generation Electronics (ISNE) - Engineered threshold voltage in AlGaN/GaN HEMTs for normally-off operation

Tsai, Jung-Ruey, Chang, Yi-Sheng, Wei, Kuo-Shu, Wen, Ting-Ting

Year:

2015

Language:

english

File:

PDF, 229 KB

english, 2015

41

Use of HLA-B*58:01 genotyping to prevent allopurinol induced severe cutaneous adverse reactions in Taiwan: national prospective cohort study

Ko, Tai-Ming, Tsai, Chang-Youh, Chen, Shih-Yang, Chen, Kuo-Shu, Yu, Kuang-Hui, Chu, Chih-Sheng, Huang, Chung-Ming, Wang, Chrong-Reen, Weng, Chia-Tse, Yu, Chia-Li, Hsieh, Song-Chou, Tsai, Jer-Chia, Lai

Journal:

Year:

2015

Language:

english

File:

PDF, 314 KB

english, 2015

42

[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Utilization of Zn alloy for the manufacture of automotive power device modules

Kao, Kuo-Shu, Chung, Su-Ching, Fan, Chia-Wen, Chang, Jing-Yao, Chang, Tao-Chih

Year:

2015

Language:

english

File:

PDF, 471 KB

english, 2015

43

Rapid diagnosis of Mycobacterium abscessus hand infection by oligonucleotide array in an immunocompetent patient

Hung, Kuo-Shu, Chang, Tsung-Chain, Lee, Yao-Chou

Journal:

Journal of Plastic, Reconstructive & Aesthetic Surgery

Year:

2015

Language:

english

File:

PDF, 887 KB

english, 2015

44

[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Development of packaging technologies for SiC power module

Chun-Kai Liu,, Yu-Lin Chao,, Wei Li,, Chih-Ming Tzeng,, Kuo-Shu Kao,, Jing-Yao Chang,, Rong-Chang Fang,

Year:

2015

Language:

english

File:

PDF, 946 KB

english, 2015

45

SPIE Proceedings [SPIE Photonics West '98 Electronic Imaging - San Jose, CA (Saturday 24 January 1998)] Visual Communications and Image Processing '98 - Fast PNN algorithm for design of VQ initial codebook

Shen, Day-Fann, Chang, Kuo-Shu, Rajala, Sarah A., Rabbani, Majid

Year:

1998

Language:

english

File:

PDF, 293 KB

english, 1998

46

SPIE Proceedings [SPIE Photonics Taiwan - Taipei, Taiwan (Wednesday 26 July 2000)] Input/Output and Imaging Technolgies II - Some contributions to wavelet-based image coding

Li, Yi-Wei, Chang, Kuo-Shu, Yan, Loon-Shan, Shen, Day-Fann, Liu, Yung-Sheng, Huang, Thomas S.

Year:

2000

Language:

english

File:

PDF, 304 KB

english, 2000

47

Corrigendum to “Nutrient supply in the Southern East China Sea after Typhoon Morakot”

Hung, Chin-Chang, Chung, Chih-Ching, Gong, Gwo-Ching, Jan, Sen, Tsai, Yaling, Chen, Kuo-Shu, Chou, Wen Chen, Lee, Ming-An, Chang, Yi, Chen, Meng-Hsien, Yang, Wen-Rong, Tseng, Chiung-Jung, Gawarkiewicz

Journal:

Journal of Marine Research

Year:

2013

Language:

english

File:

PDF, 210 KB

english, 2013

48

Total Maxillary Reconstruction With a Bi-Paddle Double-Barrel Osteocutaneous Fibular Flap and Arteriovenous Saphenous Loop After a Globe-Sparing Total Maxillectomy Due to Osteosarcoma

Tseng, Wan-Ling, Chang, Tzu-Yen, Hung, Kuo-Shu, Chen, Szu-Han, Hsiao, Jenn-Ren, Lee, Yao-Chou

Journal:

Journal of Craniofacial Surgery

Year:

2017

Language:

english

File:

PDF, 585 KB

english, 2017

49

Non-Hepatic Alkaline Phosphatase, hs-CRP and Progression of Vertebral Fracture in Patients with Rheumatoid Arthritis: A Population-Based Longitudinal Study

Yeh, Jih-Chen, Wu, Chang-Chin, Choy, Cheuk-Sing, Chang, Shu-Wei, Liou, Jian-Chiun, Chen, Kuo-Shu, Tung, Tao-Hsin, Lin, Wei-Ning, Hsieh, Chih-Yu, Ho, Chun-Ta, Wang, Ting-Ming, Chang, Jia-Feng

Journal:

Journal of Clinical Medicine

Year:

2018

Language:

english

File:

PDF, 3.65 MB

english, 2018

50

Comparison of flap outcomes between single- and multiple-perforator-based free anterolateral thigh flap in head and neck reconstruction

Wang, Kuan-Chih, Tsai, Chia-Chin, Chang, Chih-Hao, Tseng, Wan-Ling, Hung, Kuo-Shu, Chang, Tzu-Yen, Chen, Szu-Han, Lee, Yao-Chou

Journal:

Year:

2018

Language:

english

File:

PDF, 956 KB

english, 2018

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